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Lanner and Compal Collaborate on Building the 5G Open RAN Solutions

Feb 22, 2023

New Taipei City, February 22, 2023, Today, Lanner Electronics, a leader in the design and manufacturing of network appliances, and Compal Electronics, the innovator in 5G infrastructure, are excited to announce the availability of the joint 5G Open RAN Solution built with Lanner’s DU/CU network appliances and Compal’s O-RAN inline acceleration card. The joint solution delivers a programmable, fully disaggregated 5G RAN platform with high efficiency in data transfer and power consumption.

To enable high-performance, low-latency communications for 5G vertical applications, Lanner offers the interoperable Open DU/CU network appliances ECA-4027 equipped with Compal’s in-line acceleration card designed to offload the CPU loading with reduced power. According to the latest benchmark testing, ECA-4027 integrated with Compal’s in-line acceleration card can achieve 44% CPU computing resources with 17% less energy, making it an ideal platform to enable Kubernetes-containerized 5G RAN applications.

Powered by 12~16 cores Intel® Xeon® D-2100 series processor (codenamed Skylake-D), the ECA-4027 is a 37cm short-depth CU/DU edge server, offering 8x 10G SFP+ ports, -40 to 65°C wide operating temperature range, Intel® QAT crypto acceleration, IEEE 1588v2 Time Sync support and PCI-E expansion capability for in-line acceleration.

Compal’s inline high-PHY accelerator card (codenamed McLaren) is a full-height, 3/4 length FPGA accelerator powered by NXP® Layerscape LX2160 processor, max. 64GB memory and 4x 10/25GbE SFP28 ports. The inline accelerator can unleash the CPU loading from massive data transfer between CPU and accelerator, resulting in improved performance and power efficiency. Additionally, Compal’s Teak, the Open RU system powered by NXP®, completes the last piece of 5G Open RAN solutions by supporting 4T4R at 100Mhz with a maximum of 24dBm.

“Lanner is delighted to embed Compal’s inline acceleration card on Lanner’s latest O-RAN platform,” said Jeans Tseng, CTO of Lanner Electronics. “By pre-validating the DU/CU server, FPGA accelerator, and RAN software, the 5G Open RAN solution allows service providers and enterprises to deploy private networks with reduced cost of ownership and accelerated time-to-market.”

 

About Lanner Electronics

Lanner Electronics Inc (TAIEX 6245) is a world-leading provider of design, engineering, and manufacturing services for SDN and NFV network computing appliances for system integrators, service providers, and application developers.
www.lannerinc.com

 

About Compal Electronics

Compal is worldwide leading laptop computer and smart device manufacturer with outstanding management and solid R&D capacity. By collaborating with top tier brands globally, Compal offers variety of product lines ranging from computing to communication, consumer electronics devices, cloud servers, car electronics and health care. For more information, please visit: www.compal.com/5g/

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